Innerlayer

• CHEMBOND 300 - One-step cleaner/adhesion
  promoter that eliminates the need for microetch.

• LAYERCLEAN CR - Highly concentrated,
  chloride-free, non-etching copper cleaner for
  fast removal of chromate conversion coatings
  from standard and reverse-treat foils.

• LAYER CLEAN NP - Phosphate-free acid cleaner
  for enhanced chromate removal.  Effective in both
  spray and soak applications.

• NC ACID CLEANER - Non-chelating,
  non-etching copper cleaner for removing
  chromate coating from inner layer material.

• ULTRACLEAN NF - General purpose alkaline
  copper cleaner for removal of organics and
  fingerprints from copper surfaces.
  

Pre-Plate

• AT-3000 - Concentrated, acid-based anti-tarnish
  for use after electroless copper or any other
  process that requires an extended hold time
  or adhesion promoter.

• POSICLEAN™ C - Non-etching, phosphoric
  based pattern plate cleaner for immersion
  applications.  Consistently provides extended
  bath life and removes all organic and inorganic
  soils prior to acid copper plating.

• POSICLEAN™ B - Hydrochloric based pattern
  plate cleaner for immersion applications.
  Provides complete cleaning of organic and
  inorganic soils without excess copper attack.

• POSICLEAN™ M - Sulfuric based pattern
  plate cleaner for immersion applications. 
  Removes oxidation, tarnish and organic
  soils prior to pattern plating.

• Other Copper Cleaners:
  • CIRCUTEK AC-300

Micro-Etch

• ACCUCLEAN NF - Mild low-etching,
  non-foaming, hydrochloric based cleaner
  designed for spray applications.

• CIRCUTEK ME-515 - Potassium monopersulfate
  microetch, producing a uniform predictable etch
  rate with maximum surface topography. Remains
  very stable in solution over long periods.

• ME-515L - Liquid sodium persulfate microetch
  designed for spray applications.

• QUANTUM ETCH - Stabilized peroxide based
  microetch for spray or immersion applications.

• SUR CLEAN 92 - Ferric chloride based acid
  copper cleaner or microetch for general
  purpose applications.

RBP Chemical Technology, Inc.
150 S. 118th Street
Milwaukee, WI USA 53214-0069
1-800-558-0747
Outside USA: 1-414-258-0911

© Copyright 2006 RBP Chemical, Inc.
All Rights Reserved.

DEVELOPING

RESIST STRIPPING

OXIDE

COPPER CLEANING

DESMEAR &
ELECTROLESS COPPER

ELECTROLYTIC PLATING

COPPER ETCHING

TIN / SOLDER STRIPPING

HAL / FUSING

SOLDER CONDITIONING

FILM CLEANING

EQUIPMENT CLEANING

SOLDERMASK STRIPPING

SCREEN CLEANING

IR FUSING

WASTE TREATMENT

OTHER PRODUCTS

COMMODITY PRODUCTS