Desmear / Etchback

• MAGNUM GE-600 - A non-ammoniated
  glass etch for use in desmear or etchback
  applications.

• MAGNUM K-401 OXIDIZER - Low cost
  potassium permanganate designed for
  desmear applications of conventional resins. 
  Maximizes surface topography for superior
  adhesion of electroless copper.

• MAGNUM N-501 OXIDIZER - Concentrated
  sodium permanganate designed for desmear
  & etchback applications on high Tg resins. 
  Provides maximum surface topography for
  superior adhesion of electroless copper.

• MAGNUM N-599 - Neutralizer for
  permanganate residues.

• MAGNUM S-400 - Biodegradable,
  highly effective sensitizer for use prior to
  permanganate. Ideal for desmear or
  etchback applications.
  

Pre-Plate

• CIRCUTEK A-778 - Accelerator for modifying
  the activated surface to improve hole wall
  adhesion.

• CIRCUTEK C-777 - Colloidal palladium
  activator to catalyze substrates for subsequent
  electroless copper plating.

• CIRCUTEK CC-710 - Alkaline cleaner/
  conditioner designed to clean and condition
  the glass and resin for better electroless
  copper coverage.

• CIRCUTEK CC-904 - Alkaline cleaner/
  conditioner with effective cleaning and
  clean rinsing characteristics.

• CIRCUTEK PD-776 - Liquid pre-dip to
  neutralize the substrate and prevent water
  drag-in into the activator.

• CIRCUTEK PD-776 S - Powdered version
  of the PD-776.

• CIRCUTEK CU-825 - Copper colloidal catalyst.
  

Electroless Copper

• CIRCUTEK PC-701 - Highly stable, quadrol
  based electroless copper designed to deposit
  70-90 microinches in 30 minutes at 90-110°F.
  Produces a uniform electroless copper
  deposit with excellent resistance to
  subsequent processes.

• CIRCUTEK EC-1050 - Highly stable, quadrol
  based thin deposition electroless copper
  designed to plate 25-50 microinches in
  15-30 minutes at 75-90°F.

RBP Chemical Technology, Inc.
150 S. 118th Street
Milwaukee, WI USA 53214-0069
1-800-558-0747
Outside USA: 1-414-258-0911

© Copyright 2006 RBP Chemical Technology, Inc.
All Rights Reserved.

DEVELOPING

RESIST STRIPPING

OXIDE

COPPER CLEANING

DESMEAR &
ELECTROLESS COPPER

ELECTROLYTIC PLATING

COPPER ETCHING

TIN / SOLDER STRIPPING

HAL / FUSING

SOLDER CONDITIONING

FILM CLEANING

EQUIPMENT CLEANING

SOLDERMASK STRIPPING

SCREEN CLEANING

IR FUSING

WASTE TREATMENT

OTHER PRODUCTS

COMMODITY PRODUCTS